Overclocking engineer 'Der8auer' has come out with his newest product: The Skylake-X Direct Die Frame cooling bracket. The bracket is intended to replace the ILM (independent loading mechanism) on the motherboard, used to act as a shim between a delidded CPU and a cooler. The goal is to not only delid the CPU and replace the compound, but also completely eliminate the heatspreader. Traditionally, the IHS would be kept post-delid, just with better compound and with removal of the silicone adhesive. In this application, you would delid the CPU, refresh the compound, remove the adhesive, and leave the IHS off, then mount it in the Skylake-X direct die bracket.
All waterblocks on the market are using 4 screws standard installation bracket, however, to eliminate uneven stresses on the CPU core many company use springs. For direct on die Ncore’s installation it was not enough, its special floating fixture uses hinge concept to eliminate stresses. Heres how I envision it going: 1) remove the retention bracket on the mobo to allow the water block to reach the die without an IHS 2) carefully.
Some of our recent delid-focused content, 'What We've Learned Delidding Intel CPUs,' has highlighted that a light silicone adhesive seal vs. no seal vs. heavy seal can have significant impact on cooling. Heavy seals, for instance, can easily result in worse performance than stock -- even with liquid metal. We recommend not resealing the IHS at all and just allowing the cooler to retain the IHS, but a seal is sometimes needed. Shipping is a good example of this.